发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, AND PRODUCTION METHOD OF STRUCTURE INCLUDING PHASE SEPARATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To form a guide pattern in a chemical epitaxy process by an easy method as well as into a favorable shape.SOLUTION: A pattern forming method includes the steps of: forming a photosensitive resin film on a support body, exposing the film, and subjecting the exposed photosensitive resin film to negative development by using a developing solution comprising an organic solvent to form a pre-pattern; applying and heating a surface treating agent on the support body where the pre-pattern is formed so as to form a neutralized film; and subjecting the pre-pattern and the neutralized film formed on the support body to alkali development so as to remove the pre-pattern from the support body and to form a pattern comprising the neutralized film on the support body. The following photosensitive resin composition is used in the above pattern forming method. The photosensitive resin composition comprises a polymeric compound, as a base component which shows decrease in solubility with the organic solvent by an action of an acid, which has a structural unit having a lactone-containing polycyclic group, a -SO- group-containing polycyclic group or a carbonate-containing polycyclic group.
申请公布号 JP2014164044(A) 申请公布日期 2014.09.08
申请号 JP20130033679 申请日期 2013.02.22
申请人 TOKYO OHKA KOGYO CO LTD 发明人 MIYASHITA KENICHIRO;SHIONO HIROHISA;MIYAGI MASARU;MATSUMIYA YU;KUROSAWA TSUYOSHI;OMORI KATSUMI
分类号 G03F7/038;G03F7/039;G03F7/32;G03F7/40;H01L21/027 主分类号 G03F7/038
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