发明名称 LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device capable of suppressing a working failure caused by spatters as much as possible by a simple construction to form a plurality of oblique holes in high quality and in an efficient manner.SOLUTION: A laser processing device 10 comprises: a laser nozzle 30 for feeding an assist gas to remove an unnecessary material and for irradiating a laser beam L at an incidence angle; a spatter shielding jig 36 arranged to cover the scattering direction of the laser beam L, with respect to the irradiated portion of the laser beam L, for shielding spatters to occur from a surface wa; and a connecting member 38 for moving the laser nozzle 30 and the spatter shielding jig 36 synchronously.
申请公布号 JP2014161895(A) 申请公布日期 2014.09.08
申请号 JP20130037231 申请日期 2013.02.27
申请人 HONDA MOTOR CO LTD 发明人 KATO DAISUKE
分类号 B23K26/382;B23K26/04;B23K26/142;B23K26/60;B23K26/70 主分类号 B23K26/382
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