发明名称 SUBSTRATE TRANSFER DEVICE AND PEELING SYSTEM
摘要 PROBLEM TO BE SOLVED: To prevent damages of a substrate.SOLUTION: A substrate transfer device according to one embodiment includes multiple nozzles and a body part. The multiple nozzles jet a gas toward a surface of a substrate and thereby hold the substrate in a non-contact manner. The body part is provided with the multiple nozzles. Further, in each nozzle, at least a surface is formed by a resin.
申请公布号 JP2014165217(A) 申请公布日期 2014.09.08
申请号 JP20130032521 申请日期 2013.02.21
申请人 TOKYO ELECTRON LTD 发明人 IWASHITA TAIJI;HIRAKAWA OSAMU;SOMA YASUTAKA;TAMURA TAKESHI;NODA KAZUTAKA
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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