| 发明名称 |
UNDERFILL SHEET, TAPE-INTEGRATED UNDERFILL SHEET FOR BACK GRINDING, DICING TAPE-INTEGRATED UNDERFILL SHEET AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
PROBLEM TO BE SOLVED: To provide an underfill sheet which can fill the protrusions and recesses in the circuit surface of a semiconductor element well, can connect the terminals of the semiconductor element and an attached body well, and can reduce outgassing.SOLUTION: An underfill sheet has a viscosity of 1000-10000 Pa s at 150°C, 0.05-0.20 rev/min, and a lowest viscosity of 100 Pa s or more at 100-200°C, 0.3-0.7 rev/min. |
| 申请公布号 |
JP2014165206(A) |
申请公布日期 |
2014.09.08 |
| 申请号 |
JP20130032386 |
申请日期 |
2013.02.21 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
MORITA KOSUKE;TAKAMOTO HISAHIDE;HANAZONO HIROYUKI;FUKUI AKIHIRO |
| 分类号 |
H01L21/60;C09J7/02;C09J11/04;C09J133/00;C09J161/10;C09J163/00;C09J201/00;C09K3/10;H01L21/301;H01L21/304;H01L23/29;H01L23/31 |
主分类号 |
H01L21/60 |
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