发明名称 SOLID STATE IMAGE PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solid state image pickup device which can provide a global shutter structure while achieving a fine pixel.SOLUTION: A solid state image pickup device comprises pixels P each including a photoelectric conversion layer for performing photoelectric conversion and a charge storage layer for storing a charge subjected to photoelectric conversion, which are provided independently from each other, in which the photoelectric conversion layer is provided on a rear face side of a semiconductor substrate and the charge storage layer is provided on a surface side of the semiconductor substrate. The photoelectric conversion layer and the charge storage layer overlaps each other at least partially.
申请公布号 JP2014165399(A) 申请公布日期 2014.09.08
申请号 JP20130036349 申请日期 2013.02.26
申请人 TOSHIBA CORP 发明人 EGAWA YOSHITAKA
分类号 H01L27/146;H04N5/374 主分类号 H01L27/146
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