| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which is capable of making sealability for a space in the electronic component suitable and can be reduced in size and thickness.SOLUTION: An electronic component 1 comprises: a first wiring board 3; a second wiring board 4 having a second conductor layer 4b; and an electronic element 2 comprising a functional body 2b provided on an element substrate 2a, wiring 2c extending from the functional body 2b to the outer peripheral side of the element substrate 2a, and an element pad 2d provided at a position corresponding to the second conductor layer 4b. The second wiring board 4 has an insulating layer 5 provided so as to expose part of the second conductor layer 4b and to surround the functional body 2b, and a conductive bonding material 6 provided on the second conductor layer 4b exposed from the insulating layer 5. The conductive bonding material 6 and the element pad 2d are electrically connected. |
