COPPER FOIL, COPPER-CLAD LAMINATE, FLEXIBLE WIRING BOARD AND THREE-DIMENSIONAL MOLDED BODY

摘要

PROBLEM TO BE SOLVED: To provide a copper foil capable of excellently perform three-dimensional molding by being laminated with a resin layer, a copper-clad laminate, a flexible wiring board and a three-dimensional molded body.SOLUTION: A copper foil 2 contains 99.9 mass% or more of Cu, and satisfies &Dgr;&sgr;=|&sgr;a(&egr;)-&sgr;b(&egr;)|<30 MPa at a/b=100 and a=1×10(s), where a and b (s) are strain rates respectively and &sgr;a(&egr;) and &sgr;b(&egr;)(MPa) are true stresses at true strain &egr; respectively.