| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board by which a polyimide resin film having few voids and excellent in insulation properties can be efficiently formed.SOLUTION: The method of manufacturing a wiring circuit board is provided for forming a polyimide precursor resin film, through spin coating, on a top face of a substrate in which a conductive structure is formed in a predetermined region of a surface. The method of manufacturing the wiring circuit board includes a steps of forming the polyimide precursor resin film on the top face of the substrate by ejecting a predetermined amount of polyimide precursor resin liquid onto the top face of the substrate while rotating the substrate at a number of revolutions of 5 to 1,000 rpm, and then rotating the substrate at a number of revolutions of 5 to 1,000 rpm for a predetermined time, followed by a step of rotating the substrate with the polyimide precursor resin film formed thereon at a number of revolutions of 100 to 3,000 rpm for a predetermined time, and further followed by a step of rotating the substrate with the polyimide precursor resin film formed thereon at a number of revolutions of 500 to 7,000 rpm for a predetermined time. |
