SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing the size of a semiconductor chip.SOLUTION: The semiconductor device includes: a semiconductor substrate 101; an MISFET 102 which is active elements formed on a first plane (surface) of the semiconductor substrate 101 and a multi-layered wiring layer 104; a pn diode 109 which is an active element formed on a second plane (rear face) of the semiconductor substrate 101 at the side opposite to the first plane; and a through electrode 108 which is formed through the semiconductor substrate 101 to electrically connect the pn diode 109 to the multi-layered wiring layer 104.