| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which has no short circuit between leads even when laser beams are used for removal of a resin burr.SOLUTION: In a semiconductor device manufacturing method, by covering an encapsulation resin and a lead frame with a soluble protection film before performing deburring by laser beams, direct adhesion of debris generated by laser irradiation can be prevented. |
