| 摘要 |
PROBLEM TO BE SOLVED: To improve the performance of cooling a power semiconductor module and reduce a variation in the performance.SOLUTION: A power conversion device includes a power semiconductor module 150a, a first passage forming body 2, and a second passage forming body 20 forming a housing space 20a housing the power semiconductor module 150a and the first passage forming body 2. The first passage forming body 2 comprises a first sidewall part, a second sidewall part and a bottom part. The first sidewall part forms a first passage space against one surface of the power semiconductor module 150a. The second sidewall part forms a second passage space against the other surface of the power semiconductor module 150a. A cooling refrigerant flows through the housing space, the first passage space and the second passage space. |
