| 摘要 |
PROBLEM TO BE SOLVED: To provide a module substrate which allows for more reliable bonding of a main substrate and a sub-substrate.SOLUTION: A module substrate 1 includes a main substrate 3 on which electronic components 2 are mounted on both sides, a sub-substrate 4 arranged on one side of the main substrate 3, an external electrode 5 formed on the outside of the sub-substrate 4, and a joining member 10 for joining the external electrode 5 and a terminal 6 on one side of the main substrate 3. The external electrode 5 includes the other side part 51 located on the other side of the sub-substrate 4, one side part 52 located on the one side thereof, and a connection 53 for connecting the one side part 52 and the other side part 51. A joint surface 101 of the joining member 10 to the external electrode 5 covers the other side part 51 and at least a part of the other side of the connection 53. |
