SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can achieve improvement in adhesion between re-wiring composed of Cu and a portion around the re-wiring; and provide a semiconductor device manufacturing method.SOLUTION: A chip size package semiconductor device 1 comprises: a substrate 2 having an element formation surface 2A; a pad terminal 5 provided on the element formation surface 2A; Cu re-wiring 9 extending from the pad terminal 5; and a resin film 16 which covers a surface 9D of the Cu re-wiring 9. The surface 9D of the Cu re-wiring 9 includes a rough surface S which is subjected to a roughening treatment.