发明名称 |
ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To reduce size of an electronic apparatus.SOLUTION: An electronic apparatus comprises a package 1 and an electronic component 2 bonded to a package 1 by bonding material 4. The bonding material 4 comprises a plurality of sintered metal particles and a plurality of getter particles. |
申请公布号 |
JP2014165290(A) |
申请公布日期 |
2014.09.08 |
申请号 |
JP20130033990 |
申请日期 |
2013.02.23 |
申请人 |
KYOCERA CORP |
发明人 |
MIYAO TAKAYUKI;KITAGAWA AKIHIKO |
分类号 |
H01L23/26;G01J1/02 |
主分类号 |
H01L23/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|