| 摘要 |
PROBLEM TO BE SOLVED: To manufacture, by targeting a printed wiring board for mix-loading/packaging various electronic components including flip chips, a flip chip mix-loaded/packaged printed wiring board fast, inexpensively, and stably by preventing, even in a case where the electrode pad unevenness (level difference) is great and where the pitch between connection pads is too narrow to form a solder resist therein, a wire short-circuit attributed to the effusion of a solder paste on a printing occasion and by accurately and stably transferring an optimal quantity of the solder paste necessary for the connection of the various electronic components so as to enable the packaging of the electronic components and a solder reflow.SOLUTION: A packaging device of the present invention is capable of transferring, even in the case of a printed wiring board accompanied by unevenness of electrode pad portions, a quantity of a solder paste necessary for electronic components accurately and stably onto the printed wiring board by using a metal mask mounted on a printer, and a favorable electronic component-packaged printed wiring board can be prepared by mounting, via a mounter, various electronic components including flip chips and then inducing a solder reflow. |
