发明名称 DIE EJECTOR AND DIE SEPARATION METHOD
摘要 The present invention relates to a die ejector. A die ejector, according to an embodiment of the present invention, includes: a supporting member having a hole existing on the center thereof and a lower surface of the film where a detachable die is attached; an elevating member having a ring shape and supplied to the hole to vertically elevate; a driving member connected to the elevating member and vertically moving the elevating member; and a pressure controlling unit connected to the hole and controlling the pressure of the hole.
申请公布号 KR20140107982(A) 申请公布日期 2014.09.05
申请号 KR20130022312 申请日期 2013.02.28
申请人 SAMSUNG ELECTRONICS CO., LTD.;SEMES CO., LTD. 发明人 HWANG, YI SUNG;CHO, SUNG HEE;KIM, BYUNG WOOK;KIM, CHUL MIN;HA, YONG DAE
分类号 H01L21/58;H01L21/48 主分类号 H01L21/58
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