| 摘要 |
Disclosed is an etching solution composition for a copper film and a titanium film. According to the present invention, the etching solution composition: includes sodium persulfate, hydrofluoric acid, phosphoric acid, benzotriazole and water as the remainder; can etch the cooper film and the titanium film at the same time; and does not generate potassium cyanide, harmful to a human body, even after an etching process. |
