发明名称 |
SN-CU-BASED LEAD-FREE SOLDER ALLOY |
摘要 |
<p>Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass% of Cu and 0.01 to 0.1 mass% of Al are contained, 0.02 to 0.1 mass% of Ti and/or 0.01 to 0.05 mass% of Co may be contained as required and the remainder is made up by Sn.</p> |
申请公布号 |
KR20140108240(A) |
申请公布日期 |
2014.09.05 |
申请号 |
KR20147017650 |
申请日期 |
2012.12.25 |
申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
OHNISHI TSUKASA;YOSHIKAWA SHUNSAKU;ISHIBASHI SEIKO;FUJIMAKI REI |
分类号 |
B23K35/26;C22C13/00;H05K3/34 |
主分类号 |
B23K35/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|