METHOD FOR FORMING METAL FILM, CONDUCTIVE INK USED IN THE METHOD, MULTILAYER WIRING BOARD, SEMICONDUCTOR SUBSTRATE, AND CAPACITOR CELL

摘要

A subject of the present invention is to provide a method for forming a metal film on the surface which comes in contact with the hole of a substrate, which can easily form the metal film by a simple method. The method for forming a metal film comprises a process of heating the substrate while conductive ink containing metal salts and a reducing agent is in contact with the surface of the substrate with holes, wherein the surface is in contact with the holes.