| 摘要 |
The present invention relates to a device for transferring large substrates without deflection in an atomic layer deposition process capable of supplying and discharging large substrates to efficiently perform a batch type atomic layer deposition process for large substrates. The device for transferring large substrates without deflection in an atomic layer deposition process according to the present invention comprises multiple jigs on which the large substrates are mounted to expose only the top surface of the substrates, and which support the large substrates without deflection; a jig chamber in which the large substrates supplied from the outside are mounted on the jigs, and from which the large substrates finishing the process in a state of being mounted on the jigs are discharged after being separated from the jigs; and a buffer chamber arranged between the jig chamber and a processing chamber, storing the multiple substrate mounting jigs discharged from the jig chamber and the multiple substrate mounting jigs discharged from the processing chamber, and transferring the substrate mounting jigs to the jig chamber or the processing chamber. |
