SPUTTERING APPARATUS AND SPUTTERING METHOD USING THE SAME

摘要

Disclosed are sputtering apparatus and sputtering method using the same. The disclosed sputtering method includes a step for forming a thin film on a substrate by spraying reaction gas from a gas bar onto a target; a step for measuring the thickness profile of the thin film formed on the substrate; and a step for differentially applying the amount of reaction gas of the gas bar in accordance with different parts of the target, according to the thickness profile. According to the sputtering method, the thickness of the thin film can be uniformly formed on the substrate to stabilize the quality of the product.