System and Method for Measuring Thermal Reliability of Multi-Chip Modules

摘要

Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.

主权项

1. A method performed by an apparatus for testing thermal reliability of a multichip module (MCM), the method comprising:
selecting a chip from a plurality of chips in the MCM; measuring a plurality of predetermined temperature parameters associated with the selected chip; and calculating a thermal resistance value using the predetermined temperature parameters.