| 发明名称 |
METHOD OF FABRICATING COPPER-NICKEL MICRO MESH CONDUCTORS |
| 摘要 |
A method of fabricating copper-nickel mesh conductors includes printing a patterned ink seed layer on a substrate. Electroless copper is plated on the printed patterned ink seed layer. A predetermined thickness of electroless nickel is plated on the plated electroless copper. |
| 申请公布号 |
US2014246226(A1) |
申请公布日期 |
2014.09.04 |
| 申请号 |
US201313784643 |
申请日期 |
2013.03.04 |
| 申请人 |
Jin Danliang;Ramakrishnan Ed S.;Petcavich Robert J. |
发明人 |
Jin Danliang;Ramakrishnan Ed S.;Petcavich Robert J. |
| 分类号 |
H05K1/09;H05K3/12 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of fabricating copper-nickel micro mesh conductors comprising:
printing a patterned ink seed layer on a substrate; plating electroless copper on the printed patterned ink seed layer; and plating a predetermined thickness of electroless nickel on the plated electroless copper. |
| 地址 |
The Woodlands TX US |
