| 发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
| 摘要 |
A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers. |
| 申请公布号 |
US2014246604(A1) |
申请公布日期 |
2014.09.04 |
| 申请号 |
US201414275725 |
申请日期 |
2014.05.12 |
| 申请人 |
LG Innotek Co., Ltd. |
发明人 |
Kim Byung Mok;Kang Bo Hee;KIM Ha Na;Kodaira Hiroshi;Tanda Yuichiro;Ozeki Satoshi |
| 分类号 |
H01L33/64;A61L2/08 |
主分类号 |
H01L33/64 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device package comprising:
a package body including a plurality of first ceramic layers; at least one electrode pattern placed on the package body; at least one light emitting device electrically connected to the electrode pattern; and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers. |
| 地址 |
Seoul KR |
