Power converter e.g. multi polarity inverters, has first circuitry carriers, which are provided with electronic circuit portions, which are placed to directly bonded copper substrates

摘要

The converter has first circuitry carriers (20) in which a high current region are implemented. A second circuitry carrier is provided in which a logic portion is implemented. The first circuitry carriers are provided with electronic circuit portions, which are placed to directly bonded copper (DBC) substrates (12, 14, 16, 18). A frame (8) is provided for enclosing a punching lattice (10). The coupling modules are formed as ferrite cores.