INTEGRATED PLATFORM FOR IMPROVED WAFER MANUFACTURING QUALITY

摘要

The present invention relates to a method and a device for performing a dry plasma process while suppressing the inside pollution of a semiconductor board. In several embodiments, the device includes a semiconductor processing tool including a dry process stage with at least one dry process component performing the dry plasma process to the semiconductor board received from an insertion port. A wafer transfer system transfers the semiconductor board from a dry process stage to a wet cleaning stage placed in the downstream of the dry process stage. The wet cleaning stage includes at least wet cleaning component performing the wet cleaning process to remove pollutants from a surface of the board before the board is provided to a leakage port. The wet cleaning process improves wafer manufacturing quality by removing inner pollutants in the dry process stage from the semiconductor board.