PERIPHERAL ELECTRICAL CONNECTION OF PACKAGE ON PACKAGE

摘要

According to various embodiments of a mechanism that a die package is formed using a through sidewall via (TsV) which is formed by sawing a through substrate via (TSV) in half, various semiconductor dies and passive components may be electrically connected to achieve targeted electrical performance at edges of a described die. A redistribution structure with a redistribution layer (RDL) is used along with the TsV to facilitate the electrical connection. Since the TsV is away from a device region, the device region does not receive the stress caused by the TSV formation. In addition, electrical connection between upper and lower dies by the TsV increases the efficiency of the area utilization of the die package.