RESIN ENCAPSULATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a lead frame used in manufacturing of a semiconductor device of an integral molding type which does not cause an accident such as a solder bridge at the time of mounting on a substrate.SOLUTION: A resin encapsulated semiconductor device comprises: a plurality of lead frames 10 arranged in a matrix via grid leads L and terminal parts 5 of the neighboring lead frames 10 are connected by the grid lead L; and thin wall parts each formed in a region including the grid lead L and a part around a base of the terminal part 5 by half etching from a front surface or a rear face, and which are formed to the outside of a cut line by a dicing saw.