发明名称 HEAT DISSIPATION STRUCTURE
摘要 A heat dissipation structure includes a main body. The main body has a chamber. The chamber has an evaporation section, a condensation section, a first backflow section and a second backflow section. The evaporation section and the condensation section and the first and second backflow sections communicate with each other. A junction between the first and second backflow sections is coated with a heat insulation coating. A working fluid is filled in the chamber. By means of the heat insulation coating, the heat leakage between the evaporation section and the condensation section can be avoided. In this case, the vapor-liquid circulation of the working fluid in the heat dissipation structure can be continuously successfully performed.
申请公布号 US2014246176(A1) 申请公布日期 2014.09.04
申请号 US201313784743 申请日期 2013.03.04
申请人 ASIA VITAL COMPONENTS CO., LTD. 发明人 Yang Hsiu-Wei
分类号 F28D15/04 主分类号 F28D15/04
代理机构 代理人
主权项 1. A heat dissipation structure comprising a main body, the main body having a chamber, the chamber having an evaporation section, a condensation section, a first backflow section and a second backflow section, the evaporation section and the condensation section and the first and second backflow sections communicating with each other, a junction between the first and second backflow sections being coated with a heat insulation coating, a working fluid being filled in the chamber.
地址 New Taipei City TW