| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a light-emitting diode chip and a method for manufacturing the same.SOLUTION: A light-emitting diode chip includes a translucent substrate 310 and a light-emitting diode lamination structure 320 composed of an N-type semiconductor layer provided on the translucent substrate 310, a light-emitting layer provided on the N-type semiconductor layer, and a P-type semiconductor layer provided on the light-emitting layer. An edge sidewall of the N-type semiconductor layer and/or translucent substrate 310 includes a plurality of recess microstructures 312. The recess microstructure 312 is formed by an etching method.</p> |
