| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in heat resistance, curability, and the like, and to provide a cured product thereof.SOLUTION: An epoxy resin composition contains 45-1,000 pts.wt. of a component (B) with respect to 100 pts.wt. of the following component (A). The component (A) is an epoxy resin component which is represented by following formula (1) and has an epoxy equivalent of 100-3,000 g/equivalent. The component (B) is a phenolic curing agent. (In formula (1), Rto Rare the above formula (2) or a hydrogen atom, Rto Rare a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms, m is an integer of 0-2, and n is an average value of the number of repetitions and 0 or more and 150 or less). |
