发明名称 PATTERN FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To easily inspect whether or not a polymer material is appropriately applied, and estimate a correction amount of an application condition.SOLUTION: A pattern formation method according to an embodiment includes: forming a physical guide that includes a first pattern in a first region on a lower layer film and includes a second pattern in a second region; embedding a polymer material in a recess part of the physical guide; forming a self-organization pattern having a first polymer part and a second polymer part by micro-phase separating the polymer material; observing the self-organization pattern in the second region; selectively removing the first polymer part and processing the lower layer film using the physical guide and the second polymer part as a mask when it is determined from a result of the observation that the self-organization pattern in the first region has a predetermined shape. The second pattern includes a pattern, whose coverage ratio is greater than that of the first pattern, and a pattern, whose coverage ratio is smaller than that of the first pattern.
申请公布号 JP2014160734(A) 申请公布日期 2014.09.04
申请号 JP20130030319 申请日期 2013.02.19
申请人 TOSHIBA CORP 发明人 KIYONO YURIKO;YONEMITSURU HIROKI
分类号 H01L21/027 主分类号 H01L21/027
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