发明名称 |
THIN FILMS AND PREPARATION PROCESS THEREOF |
摘要 |
A process for the preparation of a thin film having at least one layer of a predetermined thickness not exceeding 5 microns is provided such that the integrity of the thin film is preserved. The process for the preparation of such a thin film comprises the step of rolling at least one sheet. The step of rolling is preceded by a step of stacking at least one sheet on a substrate having a predetermined thickness. The process of stacking preferably includes the step of bonding at least one sheet to a substrate. The sheet is a metal, alloy or a combination thereof, the metal and the alloy being of metals selected from the groups IB, IIB, IIIA, IVA, IVB, VB and VIB. |
申请公布号 |
US2014246088(A1) |
申请公布日期 |
2014.09.04 |
申请号 |
US201214353227 |
申请日期 |
2012.10.23 |
申请人 |
RELIANCE INDUSTRIES LIMITED |
发明人 |
Agarwal Uday;Patil Swanand |
分类号 |
H01L31/18;B21C1/00;H01L31/032;B21B1/00;H01L31/0352;H01L31/0272 |
主分类号 |
H01L31/18 |
代理机构 |
|
代理人 |
|
主权项 |
1. A process for the preparation of a thin film, said process comprising the step of:
metalworking at least one sheet to obtain said thin film having at least one layer of a predetermined thickness not exceeding 5 microns, wherein the integrity of said thin film is preserved,said sheet being a sheet of metal, alloy or a combination thereof, the metal and the alloy being of metals selected from the groups IB, IIB, IIIA, IVA, IVB, VB and VIB. |
地址 |
Mumbai, Maharashtra IN |