发明名称 IN-SITU SPUTTERING APPARATUS
摘要 <p>A sputtering apparatus (100) that includes at least a target (164) presented as an inner surface of a confinement structure (166), the inner surface of the confinement structure is preferably an internal wall of a circular tube. A cathode (102, 104) is disposed adjacent the internal wall of the circular tube. The cathode preferably provides a hollow core, within which a magnetron is disposed. Preferably, an actuator (168, 170, 196) is attached to the magnetron, wherein a position of the magnetron within the hollow core is altered upon activation of the actuator. Additionally, a carriage (112) supporting the cathode and communicating with the target is preferably provided, and a cable bundle (120) interacting with the cathode and linked to a cable bundle take up mechanism (146) provided power and coolant to the cathode, magnetron, actuator and an anode (108) of the sputtering apparatus.</p>
申请公布号 WO2014133565(A1) 申请公布日期 2014.09.04
申请号 WO2013US35374 申请日期 2013.04.05
申请人 POOLE VENTURA, INC. 发明人 ERICKSON, MARK, R.;POOLE, HENRY, J.;CUSTER, ARTHUR, W.
分类号 C23C14/34 主分类号 C23C14/34
代理机构 代理人
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