| 发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| 摘要 |
A semiconductor device includes an insulating substrate having a semiconductor element mounted thereon; an outer case accommodating the insulating substrate; and a metallic terminal bar disposed above the insulating substrate and fixed to side walls of the outer case at both ends thereof. Each of both ends of the terminal bar at a position close to the side wall of the outer case at a surface on an opposite side to a surface facing the insulating substrate is provided with a pressed groove. |
| 申请公布号 |
US2014246769(A1) |
申请公布日期 |
2014.09.04 |
| 申请号 |
US201214351457 |
申请日期 |
2012.09.12 |
| 申请人 |
Takahashi Hideaki;Karasawa Tatsuya;Sakamoto Yo |
发明人 |
Takahashi Hideaki;Karasawa Tatsuya;Sakamoto Yo |
| 分类号 |
H01L23/498;H01L21/48 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
an insulating substrate having a semiconductor element mounted thereon; an outer case accommodating the insulating substrate; and a metallic terminal bar disposed above the insulating substrate and fixed to side walls of the outer case at two ends thereof, wherein each of the two ends of the terminal bar at a position close to the side wall of the outer case at a surface on an opposite side to a surface facing the insulating substrate is provided with a pressed groove. |
| 地址 |
Omachi-shi JP |
