| 发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device that improves noise performance includes a circuit substrate, an enclosing case, and a metal part. A control circuit is mounted on the front surface of the circuit substrate. The enclosing case is a resin case in which semiconductor elements are installed. The metal part, included inside the enclosing case, includes a first mounting portion, a second mounting portion, and a bus bar. The first mounting portion mounts the circuit substrate on the enclosing case, and is connected to a ground pattern of the circuit substrate when mounting. The second mounting portion mounts an external instrument on the enclosing case, and is grounded when mounting. The bus bar connects the first mounting portion and second mounting portion. |
| 申请公布号 |
US2014246768(A1) |
申请公布日期 |
2014.09.04 |
| 申请号 |
US201414276665 |
申请日期 |
2014.05.13 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
SOYANO Shin |
| 分类号 |
H01L23/00;H01L23/02;H05K13/00;H01L23/50 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
an enclosing case in which semiconductor elements are installed; a circuit substrate on which a control circuit is mounted; and a metal part, having a first mounting portion which mounts the circuit substrate on the enclosing case and is connected to a ground pattern of the circuit substrate when mounting, and a second mounting portion which mounts an external instrument on the enclosing case and is grounded when mounting, which connects the first mounting portion and second mounting portion with a bus bar. |
| 地址 |
Kawasaki-shi JP |
