ELECTRONIC APPARATUS COOLING SYSTEM AND ELECTRONIC APPARATUS COOLING SYSTEM FABRICATION METHOD

摘要

[Problem] To provide an electronic apparatus cooling system having superior cooling characteristics and portability. [Solution] A rack (2) is installed within a container (1). A heat receiving apparatus (3) is disposed on a lateral face of the rack (2), and receives heat emitted within the rack (2) by a liquid-phase cooling medium gasifying and becoming a gaseous-phase cooling medium. A gaseous-phase tube (6) is disposed extending in plumb direction, and transports the gaseous-phase cooling medium from the heat receiving apparatus (3). A heat radiating apparatus (4) is disposed above the rack (2) outside the container (1), and radiates the heat which the heat receiving apparatus (3) has received by cooling the gaseous-phase cooling medium flowing from the gaseous-phase tube (6), making said gaseous-phase cooling medium into the liquid-phase cooling medium. A liquid-phase tube (7) transports the liquid-phase cooling medium from the heat radiating apparatus (4) to the heat receiving apparatus (3). The gaseous-phase tube (6) further comprises a gaseous-phase tube bend part (6c) whereat cooling medium droplets, which arise from the condensation of the gaseous phase cooling medium as a result of the gaseous-phase tube (6) being exposed to the environment external to the container (1), are collected.