发明名称 Analysis device installed in laser processing machine for analyzing laser radiation, has beam sensor that analyzes laser radiation in main beam path, and optical devices that analyzes respective analysis beam aligned on beam sensor
摘要 <p>The analysis device (100) has main beam path (AB) that is arranged with optical component (10). A main beam (S0) is provided optically adjusting the laser radiation. A beam sensor (3) is arranged for analyzing laser radiation in main beam path separate from observation beam path (BC). A partly transparent mirror (2) is arranged between optical component and beam sensor. Optical devices (20,30) are arranged for analyzing respective analysis beam (S1,S2) to be aligned on beam sensor.</p>
申请公布号 DE102013008774(B3) 申请公布日期 2014.09.04
申请号 DE20131008774 申请日期 2013.05.23
申请人 TRUMPF WERKZEUGMASCHINEN GMBH + CO. KG 发明人 WEICK, JÜRGEN-MICHAEL;VEES, DOMINIK;HÄCKER, MICHAEL;BURGER, DIETER, DR.
分类号 G01J1/42;B23K26/03;B23K26/70;G02B3/00;G02B5/08;G02B5/20;G02B7/00;G02B27/14 主分类号 G01J1/42
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