| 摘要 |
PROBLEM TO BE SOLVED: To reliably establish thermal coupling between communication modules and a cooling mechanism provided on a substrate on which the communication modules are mounted.SOLUTION: A signal transmission device 1 comprising communication modules 10 mounted on a motherboard 2 having heat sinks 4, 5 includes; slots 6a, 6b which are located abutting the heat sinks 4, 5 on the motherboard 2 and are used for inserting and removing the communication modules 10; and leaf springs 21 which protrude from inner surfaces of the slots 6a, 6b and are brought into contact with the communication modules 10 inserted to the slots 6a, 6b to push the same toward the heat sinks 4, 5. Each leaf spring 21 starts touching a respective communication module 10 when insertion depth of the communication module 10 in a respective slot 6a, 6b reaches a predetermined depth after a bottom end, in an inserting direction, of the communication module 10 being inserted to the slot 6a, 6b passes the leaf spring 21. |
