发明名称 SEGMENTED GUARD RING STRUCTURES WITH ELECTRICALLY INSULATED GAP STRUCTURES AND DESIGN STRUCTURES THEREOF
摘要 <p>Disclosed are guard ring structures with an electrically insulated gap in a substrate to reduce or eliminate device coupling of integrated circuit chips, methods of manufacture and design structures. The method includes forming a guard ring structure comprising a plurality of metal layers within dielectric layers. The method further includes forming diffusion regions to electrically insulate a gap in a substrate formed by segmented portions of the guard ring structure.</p>
申请公布号 WO2014132242(A1) 申请公布日期 2014.09.04
申请号 WO2014IB59347 申请日期 2014.02.28
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM JAPAN LTD 发明人 BARRY, ROBERT L.;CHAPMAN, PHILLIP F.;GAMBINO, JEFFREY P.;GAUTSCH, MICHAEL L.;JAFFE, MARK D.;OGG, KEVIN N.;ORNER, BRADLEY A.
分类号 H01L21/3205;H01L21/768;H01L21/822;H01L23/522;H01L27/04 主分类号 H01L21/3205
代理机构 代理人
主权项
地址