SEGMENTED GUARD RING STRUCTURES WITH ELECTRICALLY INSULATED GAP STRUCTURES AND DESIGN STRUCTURES THEREOF
摘要
<p>Disclosed are guard ring structures with an electrically insulated gap in a substrate to reduce or eliminate device coupling of integrated circuit chips, methods of manufacture and design structures. The method includes forming a guard ring structure comprising a plurality of metal layers within dielectric layers. The method further includes forming diffusion regions to electrically insulate a gap in a substrate formed by segmented portions of the guard ring structure.</p>
申请公布号
WO2014132242(A1)
申请公布日期
2014.09.04
申请号
WO2014IB59347
申请日期
2014.02.28
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM JAPAN LTD
发明人
BARRY, ROBERT L.;CHAPMAN, PHILLIP F.;GAMBINO, JEFFREY P.;GAUTSCH, MICHAEL L.;JAFFE, MARK D.;OGG, KEVIN N.;ORNER, BRADLEY A.