BLACKENED SURFACE-TREATED COPPER FOIL, METHOD FOR MANUFACTURING BLACKENED SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND FLEXIBLE PRINTED CIRCUIT BOARD

摘要

The purpose of the present invention is to provide a copper foil for a printed circuit board, the copper foil having: a blackened surface capable of improving CCD visibility during terminal connection processing and precision of flexible printed circuit board AOI detection; an appropriate roughness suitable for manufacturing flexible printed circuit boards; and favorable etching properties. To achieve said purpose, a blackened surface-treated copper foil, etc. for manufacturing flexible printed circuit boards is used, the foil being characterized in that the roughened surface of the surface-treated copper foil with a roughened surface is a black roughened surface for which the maximum high-low difference of the undulations (Wmax) is 1.2 µm or less and which is provided with a color tone having a L*a*b* color system lightness (L*) of 30 or less.