| 摘要 |
PROBLEM TO BE SOLVED: To prevent an extra blazing material of a brazing material layer from penetrating upward to an upper surface of a metal layer in an insulation substrate where a lower surface of the metal layer for improving the solderability is brazed to an upper surface of an aluminum circuit layer laminated on an upper surface of an insulation layer through the brazing material layer.SOLUTION: An upper surface 2 of a metal layer 1 of an insulation substrate 30 has solderability better than an upper surface 11 of a circuit layer 10, and a heating body 22 is soldered onto the upper surface 2 of the metal layer 1. A lower surface 3 of the metal layer 1 includes an extending part 6 which extends outward relative to an outer peripheral side surface 12 of the circuit layer 10. A corner part 8 between the extending part 6 of the lower surface 3 of the metal layer 1 and the outer peripheral side surface 12 of the circuit layer 10 is filled with an extra brazing material 9a of a brazing material layer 9. |
