发明名称 FILM DEPOSITION METHOD
摘要 PROBLEM TO BE SOLVED: To reduce the number of times of heat treatment, in thickening of a film by utilizing cold spray.SOLUTION: A film deposition method has a step for executing a unit film deposition process repeatedly until the thickness of a film formed on a film deposition target reaches a desired film thickness. The unit film deposition process includes (A) a step S1 for installing the film deposition target in a chamber, (B) a step S2 for setting the atmosphere in the chamber in a non-oxidative gas atmosphere or a vacuum atmosphere, (C) a step S3 for depositing a film onto the film deposition target by a cold spray method in the atmosphere, and (D) a step S4 for applying heat treatment to the film deposition target after film deposition.
申请公布号 JP2014159612(A) 申请公布日期 2014.09.04
申请号 JP20130030378 申请日期 2013.02.19
申请人 MITSUBISHI HEAVY IND LTD 发明人 SAITO MAKOTO;HIRAMATSU NORIYUKI;FUKUSHIMA AKIRA
分类号 C23C24/04 主分类号 C23C24/04
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