| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation film suitably usable for uses in which it is desired that heat is released from a component that generates heat by power consumption of electrical apparatus, electronic apparatus, and such.SOLUTION: The heat radiation film includes an urethane resin and a thermal conductive filler, and has thermal conductivity equal to or larger than 0.5 W/m K, thermal emittance equal to or larger than 0.85, tensile strength equal to or larger than 5 N/20 mm, and a thickness of 10 to 30μm. |
