| 发明名称 |
PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD |
| 摘要 |
A package-on-package (PoP) assembly is provided. The package-on-package (PoP) assembly includes a first integrated circuit package and an anisotropic conductive film (ACF) disposed on a top surface of the first integrated circuit package, wherein the anisotropic conductive film comprises a plurality of conductive particles. The package-on-package (PoP) assembly also includes a second integrated circuit package disposed on a top surface of the anisotropic conductive film. |
| 申请公布号 |
US2014248741(A1) |
申请公布日期 |
2014.09.04 |
| 申请号 |
US201414278737 |
申请日期 |
2014.05.15 |
| 申请人 |
Wagiman Amir;Fung Thor Soo;Yee Fong Chin |
发明人 |
Wagiman Amir;Fung Thor Soo;Yee Fong Chin |
| 分类号 |
H01L23/00;H01L25/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a package-on-package assembly, comprising:
laminating an anisotropic conductive film on a top surface of a first integrated circuit package, wherein the anisotropic conductive film comprises a plurality of conductive particles disposed within the anisotropic conductive film; disposing a second integrated circuit package on a top surface of the anisotropic conductive film; and bonding the first and second integrated circuit packages to align the plurality of conductive particles between the first and second integrated circuit package. |
| 地址 |
Kedah MY |
