主权项 |
1. A method for manufacturing LED (light emitting diode) packages comprising:
providing a lead frame, the lead frame comprising a plurality of pairs of electrodes arranged in a matrix, and a plurality of first and second tie bars, each pair of electrodes comprising a first electrode and a second electrode adjacent to the first electrode, the first electrodes being arranged in a plurality of columns, and the second electrodes being arranged in a plurality of columns, wherein each first electrode comprises an elongated first main body and a first extension electrode protruding laterally from one end of the first main body, each second electrode comprises an elongated second main body and a second extension electrode protruding laterally from one end of the second main body, the first electrodes arranged in the same column are connected by a corresponding first tie bar, and the second electrodes arranged in the same column are connected by a corresponding second tie bar; forming a plurality of molded bodies engaging with the pairs of the first and second electrodes, each molded body surrounding and covering a plurality of pairs of the first and second electrodes disposed in two adjacent columns, and each molded body forming a plurality of reflecting cups, each reflecting cup defining a receiving cavity therein and being located over a corresponding pair of the first and second electrodes, wherein the first and second extension electrodes, together with the first and second tie bars, are exposed from an outer periphery of the corresponding molded body; preforming first through grooves at joints where each first electrode meets the corresponding first tie bar and second through grooves at joints where each second electrode meets the corresponding second tie bar; disposing a plurality of LED dies in the corresponding receiving cavities, each LED die being electrically connected to the corresponding pair of first and second electrodes exposed at a bottom of the corresponding receiving cavity; and cutting the molded bodies along connecting lines through adjacent first and second through grooves in a first direction and then along a second direction perpendicular to the first direction to obtain a plurality of individual LED packages, each LED package comprising a pair of the first and second electrodes, a reflecting cup surrounding the pair of the first and second electrodes, and an LED die disposed in a receiving cavity of the reflecting cup. |