| 摘要 |
The invention relates to a method for producing a thermally conductive and electrically insulating link between at least one electronic component (2) and a completely or partially metal radiator (5), in which the electronic component (2) and the radiator (5) form part of an assembly (1) also comprising a printed circuit (4) disposed between the electronic component (2) and the radiator (5), said printed circuit (4) comprising at least one metal layer (8, 9) and a metal insert (13). According to the method, at least one metal surface (11, 12, 15, 16, 17) is anodised and the heat from the electronic component (2) is dissipated through said surface to the radiator (5), said metal surface belonging to one of the following: the electronic component (2), the printed circuit (4) or the radiator (5). |
