| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an endoscope 9 in which connection reliability between an imaging element chip 20 and a signal cables 53 is high.SOLUTION: An endoscope 9 includes an imaging device 1 having: an imaging element chip 20 having an imaging part 21 provided on a front surface 20SA, and a bonding pad 24 provided at an outer periphery of a rear surface 20SB, connected with the imaging part 21 and having a bonding surface parallel to a main surface; a cable group 50 composed of a plurality of signal cables 53 in each of which a core wire 51 is coated by an insulation resin 52, a tip of the core wire 51 from which the insulation resin 52 is peeled is bonded with solder to the bonding pad 24 in a state of being disposed parallel to the bonding surface, and a rear end side from a bent part bending toward a center of the imaging element chip 20 vertically extends with respect to the bonding surface; and a binding part 60 for binding the plurality of signal cables 53.</p> |
