发明名称 METHODS OF FORMING DUAL GATE STRUCTURES
摘要 Semiconductor devices including dual gate structures and methods of forming such semiconductor devices are disclosed. For example, semiconductor devices are disclosed that include a first gate stack that may include a first conductive gate structure formed from a first material, and a second gate stack that may include a dielectric structure formed from an oxide of the first material. For another example, methods including forming a high-K dielectric material layer over a semiconductor substrate, forming a first conductive material layer over the high-K dielectric material layer, oxidizing a portion of the first conductive material layer to convert the portion of the first conductive material layer to a dielectric material layer, and forming a second conductive material layer over both the conductive material layer and the dielectric material layer are also disclosed.
申请公布号 US2014248760(A1) 申请公布日期 2014.09.04
申请号 US201414274988 申请日期 2014.05.12
申请人 Micron Technology, Inc. 发明人 Goswami Jaydeb
分类号 H01L29/49;H01L29/78 主分类号 H01L29/49
代理机构 代理人
主权项 1. A method of forming a dual gate structure, the method comprising: forming a high-K dielectric material on a semiconductor substrate; forming a metal nitride material on the high-K dielectric material; exposing a portion of the metal nitride material to an oxidizing environment to convert the portion of the metal nitride material to a region of metal oxynitride material without converting another portion of the metal nitride material; and forming a conductive material on the region of metal oxynitride material and the another portion of the metal nitride material.
地址 Boise ID US