METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER USING CATION PERMEABLE BARRIER

摘要

Processes and systems for electrochemical deposition of a multi-component solder by processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids.

主权项

1. A process for electrolytically processing a microfeature workpiece as the working electrode in a first processing fluid and a counter electrode in a second processing fluid, the method comprising:
(a) contacting a surface of the microfeature workpiece with the first processing fluid, the first processing fluid including at least a first metal cation; (b) contacting the counter electrode with a second processing fluid, the second processing fluid including a second metal cation; (c) allowing the second metal cation to move from the second processing fluid to the first processing fluid, but substantially preventing movement of the first metal cation from the first processing fluid to the second processing fluid by providing a cation permeable barrier between the first processing fluid and the second processing fluid, wherein the primary mass transport of the second metal cation from the second processing fluid to the first processing fluid is across the cation permeable barrier; and (d) electrolytically depositing the first and second metal cations onto the surface of the microfeature workpiece.